Choice The Best Grinding Wheel for Industrial Agate

Agate is a new type of industrial material after diamond and ruby. It features high hardness, good wear resistance, and chemical stability. It can be made of high-precision anti-corrosion and wear-resistant parts, such as agate bearings, agate sealing rings, and agate strips, etc. The roughness requirement of agate parts is Ra=0.20-0.05 um. It takes a long time for grinding and polishing, resulting in low efficiency and high cost. Choice The Best Grinding Wheel for Industrial Agate is very important.

Rough grinding Agate

silicon carbide Grinding Wheel for Industrial Agate

Rough grinding stage: The experiments show that both diamond grinding wheel and silicon carbide grinding wheel can rough grind agate. But there are obvious differences in grinding. When diamond grinding wheels grind agate, it easily chips without heat crack or heat melting loss. When silicon carbide grinding wheels grind agate, it has plastically deformed chips caused heat melting loss on the workpiece surface.

On the other hand, although the grinding loss of silicon carbide grinding wheels is 10 times larger than that of diamond grinding wheels, it has a stable grinding process for silicon carbide grinding wheel in rough grinding. So silicon carbide grinding wheel is more economical and is an ideal for rough grinding. In the initial stage of rough grinding, the following process parameters are recommended. Vs = 19.6m/s, V w = 20m/min, grinding depth 0.05mm;In the later stage of rough grinding, the following parameters are recommended: Vs = 19.6m/s, V w = 18m/min, grinding depth 0.075mm;

Finish grinding stage

Resin Diamond Grinding Wheel for Industrial Agate

Finish grinding stage: It is proved that good roughness Ra=0.10-0.063 um can be obtained by grinding agate with silicon carbide. But it is difficult to avoid the defect of a hot-melting point on the surface, so resin bonded diamond grinding wheel is suitable for finish grinding agate. Recommended parameters:Vs = 19.4 m/s, V w = 4.5 m/min, grinding depth 0.002 mm, fa = 0.5 mm/stroke, and grinding 5-10 worktable journeys. In this way, get very small surface (Ra < 0.04 um). No hot melt layer is on the surface.